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China Suppliers Factory Hydz13mm 2.5 Height Square SMD Type HYG1325A - Lightweight, High Sound Pressure Level

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Product Features:

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Compact 13*13*2.5mm square SMD type design.

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Exceptionally small, thin, and lightweight, making it ideal for various applications.

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Delivers a high sound pressure level with crystal-clear audio quality.

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Suitable for reflow soldering processes, ensuring easy integration into your product.

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Available in tape & reel packaging for convenient handling and assembly.

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As a leading factory and supplier in China, we pride ourselves on providing high-quality audio components that meet the demands of modern electronics.

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    ⚡ Electrical Characteristics
    Item HYG1325A
    Operating Voltage Max 25Vp-p
    Resonant Frequency 4000 ± 300 Hz
    Current Consumption Max 3mA at 5Vp-p / Square Wave / 4.1KHz
    Sound Pressure Level Min 80dB at 10cm / 5Vp-p / Square Wave / 4.1KHz
    Electrostatic Capacity 15000 ± 30% pF at 1KHz / 1V
    Operating Temperature (℃) -20 ~ +70
    Storage Temperature (℃) -30 ~ +80
    Housing Material LCP (Black)
    Dimension L13.0 × W13.0 × H2.5 mm

    PS: Vp-p = 1/2 duty, square wave

    📐 Dimensions and Material
    HYG1325A Dimensions and Material Drawing

    Taking advantage of extensive acoustic and mechanical design technology and high performance ceramics, SMD piezoelectric sounders suit the thin, high-density design of electronic equipment.

    🔧 Applications
    1. Various office equipment such as PPCs, printers and keyboards
    2. Home appliances such as microwave ovens, rice cookers, etc.
    3. Confirmation sound of various audio equipment
    🔩 Notice (Soldering and Mounting)
    1 Mounting

    When mounting a pin terminal type of product to the printed circuit board, please insert the pin terminal along the hole of the board. If the product is pressed so that the terminal is not in the hole, the pin terminal would be pushed into the inside of the product and the sounds might become unstable.

    2 Double-sided Through-hole Board

    Please avoid using a double-sided through-hole board. If the melted solder touched the base of a pin terminal, a part of the plastic case would melt and the sounds might become unstable.

    3 Soldering Conditions

    (1) Flow soldering conditions for pin terminal type:
    · Temperature: within 260°C ± 5°C
    · Time: within 10 ± 1 sec.
    · Soldering part is the lead terminals excluding 1.5mm from product body.

    (2) Please do not store the products directly on the floor without anything under them to avoid damp places and/or dusty places.

    (3) Please do not store the product in places such as in a damp heated place or any place exposed to direct sunlight or excessive vibration.

    (4) Please use the products immediately after the package is opened, because the characteristics may be reduced in quality, and/or be degraded in solderability due to storage under poor conditions.

    (5) Please be sure to consult with our sales representative or engineer whenever the products are to be used in conditions not listed above.

    4 Operating Environment

    This product is designed for application in an ordinary environment (normal room temperature, humidity and atmospheric pressure).
    Do not use the products in a chemical atmosphere such as chlorine gas, acid or sulfide gas.
    Characteristics might degrade by a chemical reaction with the material used in products.

    (2) Soldering condition by soldering iron for pin terminal type:
    · Temperature: within 350 ± 5°C
    · Time: within 3.0 ± 0.5 sec.
    · Soldering part is the lead terminals excluding 1.5mm from product body.

    (3) Reflow soldering condition for surface mounting type:
    · Temperature profile: Fig. 1
    · Number of times: Within 2 maximum

    Reflow Soldering Temperature Profile Fig.1
    5 Washing

    Please avoid washing, since this product is not a sealed structure.

    6 After Mounting the Product

    (1) If the product is floating from the printed circuit board, please do not push it. When pressing, the pin terminal is pushed inside the product and the sounds might become unstable.

    (2) Please do not apply force (shock) to the product. If force is applied, the case might come off.

    (3) If the case comes off, please do not reassemble. Even if it seems to have returned to the original, the sounds might become unstable.

    (4) Please do not blow air onto the product directly. Blown air applies force to the piezoelectric diaphragm through the sound emission hole; cracks could occur and then the sounds could become unstable. In addition, there is a possibility that the case could come off.

    🛡️ Notice (Handling)
    ⚠️ Piezoelectric ceramic is fragile. Handle with care to avoid excessive force, shock, or drops.
    1

    Piezoelectric ceramic is used in this product. Please use care in handling, because ceramic is broken when excessive force is applied.

    2

    Please do not apply force to the piezoelectric diaphragm from the sound emission hole. If applying force, cracks occur and the sounds might become unstable.

    3

    Please do not drop the product or apply shock or temperature change to it. If so, the LSI might be destroyed by the charge (surge voltage) generated. The figure below shows an example driving circuit using a zener diode.

    Driving Circuit Example with Zener Diode
    ⚙️ Notice (Driving)
    1

    Ag migration might occur if DC voltage is applied to the product under a high humidity environment. Please avoid using it under high humidity and design the circuit not to apply DC voltage.

    2

    When driving the product by IC, please insert the resistance of 1 to 2kΩ in series. The purpose is to protect the IC and to obtain stable sound. (Please see Fig. 2a).

    Inserting a diode in parallel to the product has the same effect. (Please see Fig. 3b)

    3 Flux or Coating Agent, etc., Various Solvents

    It is possible for a liquid solvent to penetrate inside the product, since this product is not a sealed structure. If a liquid penetrated inside and attached to the piezoelectric diaphragm, its vibration could be inhibited. If attaching to an electrical junction, the electric connection might fail.

    To prevent sound instability, please do not allow liquid to penetrate inside the product.

    Driving Circuit Diagrams Fig.2a and Fig.3b
    ❓ Frequently Asked Questions
    Q What is the operating voltage range of the HYG1325A piezoelectric sounder?
    The HYG1325A supports a maximum operating voltage of 25Vp-p. For standard testing, a 5Vp-p square wave at 4.1KHz is used. Note that Vp-p equals 1/2 duty square wave.
    Q What is the resonant frequency and sound pressure level of the HYG1325A?
    The resonant frequency is 4000 ± 300 Hz. The minimum sound pressure level is 80dB measured at 10cm distance, driven at 5Vp-p square wave at 4.1KHz.
    Q What soldering method is recommended for the HYG1325A?
    For pin terminal types, flow soldering at 260°C ± 5°C for within 10 ± 1 seconds is recommended. For surface mounting types, reflow soldering following the specified temperature profile (Fig. 1) is required, with a maximum of 2 reflow passes. Soldering iron conditions are 350 ± 5°C within 3.0 ± 0.5 seconds.
    Q Can the HYG1325A be washed after mounting?
    No. Washing should be avoided since the HYG1325A is not a sealed structure. Liquid solvents, flux, or coating agents can penetrate inside the product, inhibit diaphragm vibration, and cause electrical connection failure or unstable sound output.
    Q What precautions should be taken when driving the HYG1325A with an IC?
    When driving with an IC, insert a series resistance of 1 to 2kΩ to protect the IC and ensure stable sound output. Alternatively, inserting a diode in parallel with the product achieves the same protective effect. Also, avoid applying DC voltage under high humidity to prevent Ag migration.
    Q What are the typical applications of the HYG1325A SMD piezoelectric sounder?
    The HYG1325A is widely used in office equipment such as PPCs, printers, and keyboards, as well as home appliances including microwave ovens and rice cookers. It is also suitable for providing confirmation sounds in various audio equipment, benefiting from its compact SMD form factor and reliable acoustic performance.