China Extra-Thin Piezo SMD Buzzer HYG1109A - High Sound Pressure Level from Reliable Suppliers & Factory
| Operating Voltage | Max 25Vp-p |
| Current Consumption | Max 3.5mA at 5Vp-p/Square Wave/4.1KHz |
| Sound Pressure Level | Min 65dB at 10cm/ 5Vp-p/Square Wave/4.1KHz |
| Electrostatic Capacity | 12000±30%pF at 1 KHz/1V |
| Operating Temperature (℃) | -20 ~ +70 |
| Storage Temperature (℃) | -30 ~ +80 |
| Dimension | L11.0×W9.0×H1.7mm |
PS: Vp-p＝1/2duty, square wave
Taking advantage of extensive acoustic and mechanical design technology and high performance ceramics, SMD piezoelectric sounders suit the thin, high-density design of electronic equipment.
1. Mounting: When mounting a pin terminal type of product to the printed circuit board, please insert the pin terminal along the hole of the board. If the product is pressed so that the terminal is not in the hole, the pin terminal would be pushed into the inside of the product and the sounds might become unstable.
2. Double-sided through-hole Board: Please avoid using a double-sided through-hole board. If the melted solder touched the base of a pin terminal, a part of the plastic case would melt and the sounds might become unstable.
(1) Flow soldering conditions for pin terminal type:
· Temperature: within 260°C±5°C | Time: within 10±1 sec.
(2) Do not store products directly on the floor to avoid damp/dusty places.
(3) Avoid storage in damp heated places, direct sunlight, or excessive vibration.
(4) Use products immediately after opening the package.
(5) Consult our sales representative for conditions not listed.
4. Operating Environment: Designed for ordinary environments (normal room temperature, humidity, and atmospheric pressure). Do not use in chemical atmospheres (chlorine gas, acid, or sulfide gas).
5. Washing: Please avoid washing, since this product is not a sealed structure.
6. After Mounting: Do not push the product if it is floating. Do not apply force/shock or blow air directly onto the sound emission hole.
1. Avoid DC voltage in high humidity to prevent Ag migration.
2. When driving by IC, insert 1 to 2kΩ resistance in series or a diode in parallel to protect the IC and stabilize sound.
3. Prevent liquid solvents (flux, coating agents) from penetrating the unsealed structure to avoid vibration inhibition or electrical failure.
